US citizen (naturalized in 1985). Goal oriented, highly motivated and creative performer with proven leadership, administrative and coaching ability, extensive project and financial management experience, team player attitude, strong analytical and planning skills, effective communications (both written and verbal) and presentation skills, as well as excellent organizational, interpersonal, and negotiation capabilities. Possesses thorough and in-depth understanding of the state-of-the-art in materials, mechanical, electrical, optical, information, telecommunication, reliability and related areas of engineering, of new and emerging technologies, and a clear vision for the most promising directions in the development of applied science and engineering. Works exceptionally well in dynamic and rapidly changing environments, under pressure and in short time frames. Performs effectively across multiple organizations, companies and departments, with specialists from various disciplines and fields, and with people of different mentalities, origins, and cultural backgrounds. Good public speaker. Communicates his ideas well to any audience. Quick learner. Exhibits strong interest in, and possesses good knowledge of, foreign cultures, values, attitudes, and customs. Always willing to learn new things and has exceptional receptiveness to, and quick grasp of, new approaches and ideas. Has a sociable disposition and gets along well with peers, supervisors and subordinates. Bi-lingual: English and Russian. Fluent in Ukrainian (was born in Ukraine). Working knowledge of German (studied at school and when on the faculty of the Technical University in Vienna, Austria).
Applied Mathematics, Applied and Mathematical Physics, Materials Science and Engineering, Applied Mechanics, Design for Reliability (DfR) of Electronic, Opto-Electronic and Photonic Assemblies, Packages and System, Applied Probability and Probabilistic Physical DfR of Electronic and Photonic Devices and Systems, Analytical (Mathematical) Modeling in Applied Science and Engineering, Photonics, Fiber Optics, Mechanics of Optical Fibers, Composite and “Smart” Materials and Systems, Thin Film Mechanics and Physics, Shock and Vibration Analyses and Testing, Dynamic Response of Materials and Structures to Shocks and Vibrations, Thermal Stress Analysis, Prediction and Prevention of Thermal Stress Failures in Electronic and Optical Engineering, Solder Materials and Solder Joint Interconnections in Electronic and Optical Engineering, Polymeric Materials in Electronics and Photonics, Photovoltaic and Thermo-Electric Modules: Physical Design for Reliability, Nanotechnologies and Nanomaterials, Stretchable (Large Area) Electronics and Photonics: Physical Design for Reliability, Lattice-Misfit Systems: Stress Analysis and Reliability Evaluations, Technical Diagnostics, Prognostics and Health Monitoring (PHM), Vehicular (Automotive, Aerospace, Maritime) Electronics and Photonics: Design for Reliability, “Human-in-the-Loop”: Human-Equipment/Instrumentation-Environment Performance and Interaction.